1w 3w High Power Led Chips 6500k

Product Features:

GMKJ 1W 3W High power led chips 6500k,

• pure copper base, good thermal conductivity.

• Germany Heraeus pure gold wire.

• USA Bridgelux high bin chips 

• Max power rate to 2.5watt @ 700mA 

• Over 12 years led packaging experience. 

• EN62471,LM-80,Rohs,FCC, CE certificates approved. 

Parameter	Symbol	Conditions	Min	Avg.	Max	Units
Forward Voltage	VF	IF=350mA	2.8	--	3.2	V
Thermal Resistance Junction To Board	RΘJ-B	IF=350mA	--	8	--	°C/W
Luminous Flux	Φv	IF=350mA	140	150	160	lm
Color Temperature	IF=350mA	IF=350mA	6000		6500	K
CRI	Ra	IF=350mA	70	**	***	**
Temperature Coefficient of Forward Voltage	∆VF/∆T	IF=350mA	−−	-2	−−	mV/°C
Reverse Current	IR	VR=5V	−−	−−	10	μ A
Viewing Angle [1]	2Θ1/2	IF=350mA	−−	120	−−	Deg

Product Picture

Package Dimension

PCB technologies for LED applications

Due to the direct conversion of electrical current to light (optical radiation) in the

semiconductor, LEDs are highly efficient — more efficient than most traditional

light sources. However, with LEDs as well most of the electrical power is

converted to heat rather than light. This thermal loss must be dissipated to

ensure reliable and stable LED operation for exploiting the complete

performance and efficiency of the LEDs. Because of the trend towards

miniaturization, thermal output per surface unit is increasing, which means that

ever increasing heat is emitted onto an ever smaller surface area for dissipation.

With high-power applications, sufficient thermal management is of central

importance.

In general, many options exist to achieve this, although these depend on the

specific applications and ambient conditions. An universal, optimal design or

concept is not realizable for this reason, but has to be individually designed

according to the specific assembly, the specific requirements and the complete

system. A principal overview of PCB technologies available on the market and

their suitability for LED applications is outlined below.

PCB technologies commonly used for LED applications

As a support element with direct contact to the components, the PCB is in

certain respects the primary component for achieving thermal management.

Making mistakes here with insufficient optimization means that resultant

disadvantages at other locations in the complete system must be compensated

for by measures that increase the costs.

For this reason the following fundamental considerations must be made

beforehand:

• Which thermal quantity (power loss) must be dissipated where?

• How are the dimensions and performance data of the components?

• Where are the LEDs positioned on the PCB (position of heat sources)?

• Available space and assembly periphery?

• Application temperatures and ambient temperatures?

• What mechanisms are used to cool the system? (free or forced convection)

• How should the heat be conducted to the heat sinks?

• Do specific reliability requirements exist (e.g cycle stability)?

• Do special cost factors have to be observed?

The selection of appropriate materials for the circuit board is therefore of utmost

importance.

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