High Power Leds 1w Epistar Chips 350ma 150lm

Product Features:

• Pure Copper Base, Pure Gold Bonding wire.

• Original LED Chip like Epistar,Bridgelux,Osram

• Max Lumen efficiency up to 180lm/w.
  

• Provide Long warranty max to 4 years

• Over 12 Years LED Packaging experience

• Wide CCT Range available from 2000-20000k.

• Various View angle from 30 degree to 140 degree

• Low light attenuation <3% over 6000hrs  

• IEC62778, EN62471, RoHS, LM-80 certificate approved

Product Pictures

About GMKJ LED:

Sincentive 2009,  our company mainly produce Different LEDs with power from 0.1-500W,Color from White to  infrared, ultraviolet, R,G,B,Y, RGB full color, four-color, and full spectrum LED for plant growth lighting. With difefrent package type such as High power led, smd  led 3535, smd3528,smd2835, smd3030, smd5630, smd5050, and flip chip COB LED,MCCOB LED. We have a complete and scientific quality management system. Welcome to visit our production base in Shenzhen for business negotiation.

High power LED ppackaging Technology Questions:

1、 The task of packaging is to connect the external lead to the electrode of the LED chip, protect the LED chip, and improve the efficiency of light extraction.

2、 Packaging form LED packaging form can be said to be multifarious, mainly according to different applications using the corresponding dimensions, heat dissipation countermeasures and lighting effect. According to the packaging form, LED can be classified into lamp LED, top led, side LED, SMD LED, high power LED, etc.

3、 Package process description

1. Microscopic examination of chip inspection: whether there are mechanical damage and pockmarks on the material surface, whether the chip size and electrode size meet the process requirements, and whether the electrode pattern is complete.

2. The LED chips are still closely arranged after slicing, and the spacing is very small (about 0.1 mm)

It is not conducive to the operation of the later process. We use a chip expander to expand the film of bonding chips, and the spacing of LED chips is stretched to about 0.6 mm. But it's easy to use bad chips and waste them by hand.

3. Apply silver glue or insulating glue to the corresponding position of LED bracket. (for GaAs and SiC conductive substrates, silver glue is used for red, yellow and yellow green chips with back electrode. For the LED chip, sapphire and sapphire are used as insulation The difficulty of the process lies in the control of the dispensing amount, and the detailed process requirements are given in the colloid height and dispensing position. Due to the strict requirements for the storage and use of silver glue and insulating glue, the awakening, mixing and use time of silver glue must be paid attention to in the process.

4. There are two modes of solidification: automatic solidification and manual solidification. In fact, the automatic crystal fixing is a combination of two steps: dip glue (dispensing) and chip installation. First, put silver glue (insulating glue) on the LED bracket, and then use the vacuum nozzle to suck up the LED chip to move position, and then place it on the corresponding bracket position. In the process of automatic solidification, we should be familiar with the equipment operation programming, and adjust the gluing and installation accuracy of the equipment. In the selection of suction nozzle, try to use bakelite suction nozzle to prevent damage to the surface of LED chip, especially the blue and green chips must use bakelite. Because the steel nozzle will scratch the current diffusion layer on the chip surface.

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