Being multi-chip packaged, the light emitting area of a COB LED can contain many times more light sources in the same area that standard LEDs could occupy resulting in a greatly increased lumen output per square inch.
COB LEDs use a single circuit with just two contacts to energize the multiple diode chips it houses. This results in fewer components required per LED chip for proper operation. Furthermore, the reduced components, along with the elimination of the traditional LED chip structure packaging, can reduce the heat generated from each LED chip. The ceramic/aluminum substrate of COB LEDs also acts as a higher efficiency heat transfer medium when coupled to an external heatsink, further lowering the overall operating temperature of the assembly. When mounting a COB to a heatsink, care must be taken to choose a heatsink capable of dissipating the heat generated to enable a COB to be used to their full potential. In the long run, the proper heat dissipation increases efficiency and lowers failure rates.
Another aspect of COB LEDs that reduces failure rates is the fact that spot soldering of the individual LED chips is not necessary as each chip is directly mounted onto the substrate. The smaller amount of welding points results in lowering the rate of failure.
Light loss is decreased significantly and viewing angle is increased both due to the fact that lenses and other traditional LED packaging parts are no longer in place when using COB LEDs.
