How we make a finished LED Chip from crystals?
A. Bonding
1) Before the die attach, use the automatic film arranging machine and plasma cleaning machine to ensure the consistency of the bracket and the clean surface;
2) Inspect and analyze the height, position, glue amount, etc. of the die attach with high/low magnification microscope;
3) According to the automatic push-pull machine to test the adhesion after die bonding, and calculate and measure the CPK value;
4) Use a temperature controller to detect the solidification temperature to ensure the consistency and uniformity of the temperature;
B. Wire bonding
1) Clean the surface of the bracket according to the plasma cleaning machine;
2) Inspect and analyze the arc, height, wire diameter, and ball diameter of the welding wire according to the high/low magnification microscope;
3) Test the pulling force of the gold wire after the wire bonding and the pushing force of the bonding of the gold ball according to the automatic push-pull machine;
C.Glue pouring
1) Clean the surface of the bracket according to the plasma cleaning machine;
2) According to the high-precision electronic scale, the phosphor and silica gel are weighed and glued;
3) After dispensing and before baking, use the front measuring machine to test the photoelectric parameters to ensure the consistency of the photoelectric parameters;
4) Check the appearance after each dispensing under a high/low magnification microscope;
D. Roll cutting
1) Inspect and analyze the burrs, scratches, etc. after rolling with a high/low magnification microscope;
2) Control the temperature of the oven according to the temperature controller;
3) Adopt pure water operation to prevent contamination of the product surface;
E. LED sorting
1). Inspect the sundries, bubbles, etc. after spectroscopy with a high/low magnification microscope;
2) According to the test data comparison between the integrating sphere and the spectroscopic test instrument, perform calibration control;
3) According to the integrating sphere, the compliance of the photoelectric parameters of the spectrophotometer is controlled;
F. Taping
1) Inspect and analyze bubbles, debris, misalignment, leakage, etc. after braiding with a high/low magnification microscope;
2) Carry out photoelectric parameter sampling test according to the integrating sphere to ensure the compliance of the BIN file;
3) Control and control the performance of the product according to the high temperature and high humidity testing machine, thermal shock testing machine, and aging tester
G. Storage
1), take a certain proportion of samples, inspect the appearance and photoelectric performance of the product to ensure that it meets the requirements of the standard;
2), check the packaging quantity, label specifications, product specifications, product codes;
3) Use anti-static bags, desiccants, vacuum sealers, etc. to ensure the compliance of product packaging;
