Thanks to the development of small-pitch LEDs, technologies such as COB, IMD, and SMD have developed prosperously in the past few years and have stepped to the forefront of the world. In the ever-growing micro-pitch display market below P1.0, COB is one of the core technical routes, and it has differentiated between formal and flip-chip devices. Because flip-chip COB can truly realize the chip-level gap, there is more room for imagination. To be broad, it has attracted the attention of the industry!
The micro-pitch of LED displays has become an important trend in the development of the display industry. In recent years, COB has entered an explosive period, and more and more manufacturers have joined the COB camp. What is COB? Why is full-flip COB so popular?
What is COB?
COB (Chip on Board) technology originated in the 1960s and is an "electrical design" dedicated to simplifying the packaging structure of ultra-fine electronic components and improving the stability of the final product. Simply put, the structure of the COB package is to directly paste and solder the most primitive, bare chips or electronic components on the circuit board, and cover it with a special resin as a whole.
Formal VS Flip
Full flip-chip COB advantage
Ultra high reliability
The thickness of the encapsulation layer is further reduced, which can completely solve the problem of color lines and bright and dark lines between formal COB modules. The black field is darker, the brightness is brighter, and the contrast is higher. Support HDR digital image technology, static and high dynamic image quality is fine and perfect.
Simplified process, better display
As an upgraded product of formal COB, the full-flip COB further improves reliability based on the advantages of ultra-small dot pitch, high reliability, and non-glaring surface light source of formal COB, simplifies production process, better display effect, and perfect near-screen experience , A real chip-level pitch can be realized.
Large size and wide field of view
2K/4K/8K resolution unlimited size free stitching, suitable for large scene display. It has good viewing angle and uniformity of side-view display, no color cast under large viewing angles, and a viewing effect of 170 degrees can be achieved.
Ultra-high density, smaller dot pitch
Full flip-chip COB is a true chip-scale package, no wire bonding, and the physical space size is only limited by the size of the light-emitting chip. It breaks through the dot pitch limit of the formal chip and is the first choice for products with a dot pitch below 1.0.
Energy-saving and comfortable, good near-screen experience
Fully flip-chip light-emitting chip, under the same brightness conditions, the power consumption is reduced by 45%. Unique heat dissipation technology, under the same brightness, the surface temperature of the screen is 10℃ lower than that of the conventional LED display with a chip mounted on it, which is more suitable for application scenarios with near-screen experience.
