Product Features:
Flip chip COB is a light source specially developed for the LED application lighting market, with high pressure resistance, high temperature resistance, high luminous efficiency, high color rendering, low
Light decay, not afraid of pressing, no gold wire, undead lights, and other advantages. The flip-chip COB light source adopts the COB packaging form without gold wire structure, which saves cost
this. The substrate pad and the chip electrode are directly welded with nano-level solder paste, which is firmly pasted, has stronger thermal conductivity, and has higher light reflection efficiency and lowerThe loss resistance can make the chip withstand greater drive current, which is convenient for customers to apply the flexibility of power supply selection. Flip COB light source as a goofy
The light source mainly promoted by GUANGMAITechnology Co., Ltd., regular products are stocked for a long time, and can also be customized according to customer parameters.
Low-carbon life, new space, quality assurance, please rest assured to buy.
Product Specification:
Flip chip LED light source
What is the flip chip of the LED light source? In recent years, in the field of chips, flip chip technology is emerging, especially in the high-power, outdoor lighting application market. But due to the late development, many people don’t know what LED light source flip chip is?
To understand LED light source flip chip, we must first understand what is LED light source formal chip!
The LED light source is the first chip structure to be mounted on the chip, and it is also the chip structure commonly used in low-power chips. The structure electrode is on the top, and the materials from top to bottom are: P-GaN, light-emitting layer, N-GaN, substrate. So, relative to flipping, it’s formal
Flip-chip technology is not a new technology, in fact it has existed a long time ago. Flip-chip technology is not only used in the LED industry, but also in other semiconductor industries. At present, LED chip packaging technology has formed several genres, and different technologies correspond to different applications and have their own unique features.
At present, there are mainly three schools of LED light source chip structure, the most common is the formal structure, there are vertical structure and flip structure. Because the p and n electrodes are on the same side of the LED light source, the front-mounted structure is prone to current crowding, and the thermal resistance is high. The vertical structure can solve these two problems well, and can achieve high current density and uniformity.
In addition to the cost of materials in the future, the cost of lamps and lanterns will be reduced. It is particularly important to increase the power and reduce the number of LED light sources. The vertical structure can well meet this demand. This also leads to vertical structures that are generally used in high-power LED light source applications, while formal mounting technology is generally used in low- and medium-power LED light sources.
The flip-chip technology can also be subdivided into two categories. One is flip-chip based on the sapphire chip, the sapphire substrate is retained, which is good for heat dissipation, but the current density is not significantly increased; the other is the flip-chip structure and the lining is stripped. The bottom material can greatly increase the current density.
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