Guangmai LED is proffesional in making the COB Board on Chip Flip LED.
Flip chip COb LED Introduction:
What is LED flip-chip? In recent years, in the field of chips, flip-chip technology has sprung up, especially in the high-power, outdoor lighting application market. However, due to the late development, many people don't know what LED flip chip is.
To understand the LED flip chip, we must first understand what is the LED front chip.
The LED chip is the first chip structure to appear, and it is also the chip structure commonly used in low-power chips. In this structure, the electrode is on top, and the materials from top to bottom are: P-GaN, light-emitting layer, N-GaN, and substrate. Therefore, relative to flipping is formal.
In order to prevent the electrode from occupying the light-emitting area and affect the luminous efficiency, the chip developers designed a flip-chip structure, that is, the front-mounted chip is turned upside down, so that the light excited by the light-emitting layer is directly emitted from the other side of the electrode (the substrate is finally peeled off). The chip material is transparent). At the same time, a structure that facilitates the bonding of the LED packaging factory is designed for flip-chip. Therefore, the entire chip is called a flip chip (Flip Chip), which is more commonly used in high-power chips.
GMKJ Flip Chip COB LED list:
Product Specification
Typical Electrical & Optical Characteristics ( Ta = 25°C)
Package Dimension
Application
About Guangmai LED
Guangmai LED supports the quality concept of "high quality, zero defect". Every step and process has strict inspection and quality control. It operates in strict accordance with the ISO/TS16949 certification system. The entire series of products have passed LM-80 certification and passed CE, ROHS, EN62471, ISO9001:2008 and other related certifications. Strict inspection standards and frequent inspection frequency ensure the stability and reliability of the product.
Flip Chip advantages:
One is that there is no heat dissipation through sapphire, which can be used with high current;
The second is that the size can be smaller and the optics is easier to match;
The third is the improvement of heat dissipation function, which improves the life of the chip;
The fourth is the improvement of antistatic ability;
The fifth is to lay the foundation for the development of subsequent packaging technology.
Datasheet:
COB Board on Chip Flip LED datasheet can be download from this page.
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