The LED chip in the LED lamp is an electronic component with high heat flux density . In the process of operation , because of its static and dynamic loss , a lot of excess heat is generated , and the heat dissipation system is diverged to the outside to maintain the stability of its working temperature . At present , the luminous efficiency of LED is relatively low , resulting in higher junction temperature and lower life expectancy . In order to reduce the junction temperature and improve the life span , we must pay great attention to the problem of heat dissipation . The heat dissipation design of LED cooling solution must start from the chip to the radiator , and every link should be given full attention . Improper design of any link will cause serious heat dissipation . Therefore , we must give full attention to the design of heat dissipation . It The technology of composite phase change heats transfer of high performance micro groove group meets the heat dissipation requirement of high power LED lighting . This technology is named “ micro groove group composite phase change integrated cool technology “ . The technology has been successfully applied to the LED lamp . The heat energy of the LED chip is instantaneously distributed among the whole cool space , which prolongs the life of the LED lamp and improves the luminous efficiency .
