What is a high power LED package?
High-power LED packaging has been a research hotspot in recent years due to its complex structure and process, which directly affects the performance and life of LEDs, especially high-power white LED packaging.
The functions of high-power LED packaging mainly include:
1. Mechanical protection: to improve reliability;
2. Strengthen heat dissipation: to reduce chip junction temperature and improve LED performance;
3. Optical control: improve light output efficiency and optimize beam distribution;
4. Power supply management: including AC/DC conversion, and power control, etc.
High Power LED
What are the five key technologies of high-power LED packaging:
1. Array packaging and system integration technology
2. High light extraction rate packaging structure and process
During the use of LEDs, the loss of photons generated by radiative recombination when they are emitted outward mainly includes three aspects: internal structural defects of the chip and absorption of materials; reflection loss of photons at the exit interface due to refractive index difference; The total reflection loss caused by the incident angle greater than the critical angle of total reflection.
3. Low thermal resistance packaging process
The thermal resistance of LED package mainly includes internal thermal resistance and interface thermal resistance of materials (heat dissipation substrate and heat sink structure). The function of the heat dissipation substrate is to absorb the heat generated by the chip and conduct it to the heat sink to achieve heat exchange with the outside world.
4. Packaging production technology
Wafer bonding technology refers to the fabrication and packaging of the chip structure and circuit on the wafer (Wafer), and after the packaging is completed, it is cut to form a single chip (Chip).
5. Package reliability testing and evaluation
The failure modes of LED devices mainly include electrical failure (such as short circuit or open circuit), optical failure (such as yellowing of the potting compound caused by high temperature, optical performance deterioration, etc.) and mechanical failure (such as lead breakage, desoldering, etc.), and these factors All are related to the packaging structure and process.
