7watt 10watt cob led warm white
Guangmai COB LED list:
Package Dimension
Application
About Guangmai LED
How does flip chip cob work
On the other hand, a conventional flip chip COB shown in Figure 1 (b) has the LED chip directly bonded on the circuit electrodes without the bonding wire and epoxy. The heat generated by the LED is coupled through the chip bonding pads, circuit electrodes, MCPCB dielectric layer, and then diffused into the metal core.
COB (known as Chip-on-Board) is semi-conductor assembly technology where micro-chip also known as die is electrically interconnected instead of using traditional assembly process or individual IC packaging on the final product board. The general term meaning of this technology is direct chip attachment also refereeing to DCA. In DCA many kinds are available as substrate in form of ceramic glass or ceramic substrate which has substances of excellent dielectric and thermal property. It is also available in form of flex substrate, which exhibits bendable ability. Other names are known as COG (chip-on-glass) or COF (chip-on-flex).
In context of COB manufacturing process,
1) 'die attach' consists of applying die attach holding to board or substrate mounting chip or die over die attach materials. 2) For wire bonding, thermosonic (Au or Cu) ball bending and ultrasonic (Al) wedge bending are used to connect wires between die and substrate. 3) Last part the encapsulation is done dispensing chemical liquid (usually epoxy) over die and wires. Die and bond wires are encapsulated to protect chemical and mechanical damage.
COB process consists of three main categories to perform when manufacturing the Chip-on-Board. The first process is 'die mount or die attach', the second is 'wire bonding' and lastly 'the encapsulation of die wires'. In many COB assembly technology, FCOB(flip-chip-on-board) have chips facing downward on the board and does not require wire bonding which employs chip which the bond pads are pop up and it connects directly to pads on the board. It is necessary to underfill flip-chip on active surface to protect bumps from chemical and thermo-mechanical damage.
Datasheet:
LED COB 7W Chip Light Source White Color datasheet can be download from this page.
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