horticulture smd 3030 led 650nm 660nm
Item Name: deep red smd 3535 led 660nm 650nm
Model Number: GY-3535R6-1020-G42
Input Current: 350-700mA
Power: 1-2W
Input Voltage: 2-2.4VDC
LED package type: 3535 ceramic
Chips brand: Germany Osram
Chip size: 40*40mil
Color: 650-660nm
Key Features
Deep Red 660nm LED emitter
51% Wall Plug Efficiency
Ultra-small foot print – 3.0mm x 3.0mm
Up to 700mA drive current
Surface mount ceramic package with integrated glass lens
Low Thermal Resistance (6.0°C/W)
Electrically neutral thermal path
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable
Available on tape and reel or with MCPCB
Typical Applications
Horticulture
Photo Therapy
Machine Vision Medical
Mechanical Mounting of MCPCB MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to substrate cracking and subsequently LED dies cracking. To avoid MCPCB bending: o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws. o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3 screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will increase the likelihood of board bending. o It is recommended to always use plastics washers in combinations with the three screws. o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after tightening (with controlled torque) and then re-tighten the screws again. Thermal interface material To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when mounting the MCPCB on to the heat sink. There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal epoxies. An example of such material is Electrolube EHTC. It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating conditions. It is recommended to verify thermal design by measuring case temperature (Tc) during design phase. Wire soldering To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150o C. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601
3030 Red 660nm LED picture:
Package dimensions:
About GMKJ:
GMKJ was established in 2010 with a registered capital of 67.23 million yuan, is one of a leading semiconductor light-emitting diode enterprises in China. Our company focus on R&D and innovation continuely, now it owns more than 70 patents for inventions and utility models, the products have passed international quality certifications such as CE,RoHS,EN62471,LM-80,etc
For more details, please contact with us directly!
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