40W 12V XHP70 7070 SMD LED

40W 12V XHP70 7070 SMD LED Specs:

Product name	40W 12V XHP70 7070 SMD LED
Part number	GD-7070W500-4CD0-S2G7M-R70
Chips brand	China Sanan chips, flip chip without wire bonded inside
Input	11.5-12.5vdc with max 3A
Flux	4000-4500lm with 3A full power loaded
Power	Max 40 Watt
Color	2700K, 3000K, 4000K, 5000K, 5700K and 6500K available. CRI can be Ra>70, Ra>80 optional
Application	LED vehicle lights, LED work lights, LED flash lights
Package material	ALN Cerammic substrated package; 20mm star copper board soldered;
Lighting angle	120 degree with dome silicone lens
Brand and manufacturer	GMLEDs, GMKJ
Warranty	4 years
OEM service	1. SKD parts available; 2. Aluminum pcb boards LED assembly service is also available here.

 

Flip chip SMD LEDs are generally considered more reliable than wire bonded SMD LEDs for several reasons:

No Wire Bonding: Flip chip LEDs eliminate the need for wire bonds, which are a common failure point in traditional LED designs. Wire bonds can become loose or break due to thermal stress or mechanical strain.

Better Thermal Management: In flip chip designs, the LED chip is mounted directly onto the substrate. This direct contact enhances heat dissipation, leading to better thermal performance and longer lifespan. In contrast, wire bonded LEDs often have less efficient thermal pathways.

Smaller Size and Higher Density: Flip chip LEDs can be made smaller and packed more densely, allowing for more compact designs without compromising performance. This can be particularly advantageous in applications where space is limited.

Higher Efficiency: The direct mounting of the LED chip in flip chip designs can improve optical efficiency. This means more light output for the same amount of electrical input, contributing to overall reliability and performance.

Reduced Mechanical Stress: Since there are no wires to connect the chip to the circuit board, flip chip designs tend to experience less mechanical stress during manufacturing and operation, reducing the likelihood of failures.

Visual Explanation (Description)

Flip Chip SMD LED: Imagine a small square LED chip mounted directly onto a circuit board. The entire surface area of the chip is in contact with the substrate, which allows heat to spread evenly and efficiently. There are no wires connecting the chip, which makes it cleaner and less prone to failure.

Wire Bonded SMD LED: Picture a similar-sized LED chip, but with thin wires connecting it to the board. These wires loop over the chip, creating points where stress can accumulate. Over time, vibration or thermal cycling can cause these wires to break or detach, leading to failure.

 

 

40W 12V XHP70 7070 SMD LED Picture:

 

 

40W 12V XHP70 7070 SMD LED dimensions:

40W 12V XHP70 7070 SMD LED Eletrical specs:

Parameter	Symbol	Conditions	Min	Avg.	Max	Units
Forward Voltage	VF	IF=3000mA	12.00	--	14.00	V
Thermal Resistance Junction To Board	RΘJ-B	IF=3000mA	--	1	--	°C/W
Luminous Flux	Φv	IF=3000mA	4000	--	4500	lm
Color Temperature	CCT	IF=3000mA	4700	--	5300	K
CRI	Ra	IF=3000mA	70	--	--	--
Reverse Current	IR	VR=20V	−−	−−	10	μ A
Viewing Angle	2Θ1/2	IF=3000mA	−−	120	−−	Deg

 

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