Guangmai Technology is professional in making the Aluminium Nitride ALN LED Base Eutectic Welding SMD LED.
What is the Eutectic Die Bonding/Eutectic welding application?
Au-Sn eutectic (AuSn20), also known as gold-tin alloy, deposits the gold and stannous ions in the plating solution on the position specified in the order according to the mass fraction of Au80% and the content of tin 20% through electrolysis. Au-Sn eutectic contains two phases of AuSn (δ) and Au5Sn (ζ) low-temperature eutectic precious metal solder. Its thickness is controlled by the deposition time and can be directly soldered to the gold layer at 300°C without flux.
1. High thermal conductivity package for high-power devices.
In the popularization and application of high-power devices and high-frequency microwave devices, the problem of heat dissipation becomes more and more obvious. Among them, the heat dissipation of the high-power LED is directly reflected in the light decay of the chip and the hidden danger of the battery. The promotion of the Internet of Things requires an increase in the power of high-frequency microwaves, which directly leads to a sharp increase in the power load of the transmitting base station, resulting in serious heat generation. The matching of high-power heat-conducting substrates for electric vehicles cannot meet the requirements. The development and production of Au-Sn eutectic solder is directly related to the solution of heat dissipation problems.
2. Highly reliable packaging of miniature optoelectronic devices.
The gradual miniaturization of electronic equipment, especially the use of micro-sensors, MEMS devices and micro-lasers, all require flux-free solder pad processing on the surface of the micro-substrate. In addition, high-precision and high-reliability requirements put forward demands on packaging materials and packaging processes.
More demanding requirements. It can be seen that only AuSn20 eutectic with 80wt% gold content can meet this requirement. The traditional gold-tin alloy soldering pad uses a pre-formed sheet, and its processing technology is prepared by a physical powder metallurgy method. Although this kind of preform is suitable for airtight packaging of components, it cannot be processed in the micro area of microelectronics.
Eutectic Welding technology application:
With the large-scale promotion of electro-optical conversion devices, especially high-power LEDs and high-power lasers based on electroluminescence, and Intel Opto-Brain technology based on the principles of optical communication, all optoelectronic packaging materials and processes are required to undergo changes. . Two special requirements make AuSn20 the focus of attention in optoelectronic packaging. First of all, for the high thermal conductivity of high-power optoelectronic devices, the thermal conductivity of AuSn20 eutectic is 57w/m·K, which is the highest among solders. Secondly, reliability and micro-area processing are required. The AuSn20 eutectic has a gold content of 80wt% and a eutectic point of 280℃, which undoubtedly has excellent reliability. These characteristics make it widely used in the fields of microelectronics such as high-power LEDs, electric vehicles and lasers, as well as in the strategic fields of optical communications and optoelectronic devices.
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Application
About Guangmai
Shenzhen Guangmai Technology Co., Ltd. is a professional manufacturer of SMD LED lamp beads, in-line LED lamp beads, high-power LED chips and other products. It has a complete and scientific quality management system. The integrity, strength and product quality of Shenzhen Yongning Optoelectronics Co., Ltd. have been recognized by the industry. Friends from all walks of life are welcome to visit, guide and negotiate business.
Datasheet:
For more details, please feel free to contact with Guangmai Tech directly.
You can download the datasheet of Aluminium Nitride ALN LED Base Eutectic Welding SMD LED from the head of this page.
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