SMD 3535 LED 3w 1000mA Flip chip technology
Product Features:
High Light efficiency up to 190lm/w
Long life span over 80000hrs
Use Flip Chip bear high current and high temperature
Max Forward current up to 1500mA
Oxide Aluminum Ceramic Base with good thermal conductivity
Beautiful Light Distribution for LED Torch and automobile lighting
Cost effective choice compare with CREE XTE Series.
Product Specifications:
Absolute Maximum Ratings(At TA =25℃)
Parameter | Symbol | Rating | Unit |
DC Forward Current
| IF | 1500 | m A |
Peak pulse Current*
| IFP | 2000 | m A |
Power Dissipation
| PD | 4.5 | W |
Reverse Voltage
| VR | 5 | V |
Reverse Current
| IR | 10 | μ A |
Operating Temperature Range
| TOPR | -30 ~ +75 | °C |
Storage Temperature Range
| TSTG | -40 ~ +85 | °C |
LED Junction Temperature
| TJ | 120 | °C |
Electrical/Optical Characteristics--White (At TA=25°C)
Parameter | Symbol | Conditions | Min | Avg. | Max | Units |
Forward Voltage
| VF | IF=1000mA | 3.0 | -- | 3.40 | V |
Thermal Resistance Junction To Board
| RΘJ-B | IF=1000mA | -- | 8 | -- | °C/W |
Luminous Flux
| Φe | IF=1000mA | 300 | 400 | lm | |
Color Temperature
| λp | IF=1000mA | 6000 | 6500 | nm | |
Temperature Coefficient of Forward Voltage
| ∆VF/∆T | IF=1000mA | −− | -2 | −− | mV/°C |
Reverse Current
| IR | VR=10V | −− | −− | 10 | μ A |
Viewing Angle [1]
| 2Θ1/2 | IF=1000mA | −− | 120 | −− | Deg |
LED 3535 products list for overview:
Packing Method
1000pcs /reel in vacuum bag .
Company overview:
Manufacturer experience over 12 years.
Register capital 450Million US Dollar.
TOP10 LED Manufacturer in China
Only Focus on SMD LED,COB LED,Power LED
Production Base >6000 Square meter
Obtains over 75 technology patents.
Flip chip technology is a very popular concept at present. Its essence is to design the light-emitting area and the electrode area of the chip not in the same plane on the basis of the traditional process. At this time, the electrode area is facing the bottom of the lamp cup for mounting, which can save the welding line process. However, the precision of the solidification process is high, and it is difficult to achieve a high yield. Its advantages are as follows:
1) It has good heat dissipation function;
2) At the same time, we have flip chip epitaxy design, chip technology, chip graphics design.
3) Chip products have the advantages of low voltage, high brightness, high reliability and high saturation current density;
4) In addition, the protection circuit can be integrated on flip chip substrate, which is helpful to the reliability and performance of the chip;
5) In addition, compared with the front and vertical structure, flip chip soldering is easier to realize the chip light source technology of super power chip level module and multi-function integration, which has great advantages in the yield and performance of LED chip module.
For more info about the SMD 3535 LED 3w 1000mA Flip chip technology, you are welcome to contact with us freely.
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