SMD2835 LED 0.5W 3V 150mA
max CRI Rating to 99.
cost effective for outdoor lighting.
gold wire/alloy wire both available
pct +copper base ensure good thermal conductivity.
Sanan , Bridgelux .epistar chips.
3-4 years quality guarantee
LM80,EN62471,CE,FCC APPROVED.
| Parameter | Symbol | Conditions | Min | Avg. | Max | Units |
| Forward Voltage | VF | IF=150mA | 2.8 | -- | 3.2 | V |
| Thermal Resistance Junction To Board | RΘJ-B | IF=150mA | -- | 8 | -- | °C/W |
| Luminous Flux | Φv | IF=150mA | 60 | 65 | 70 | lm |
| Color Temperature | IF=150mA | IF=150mA | 6000 | 6500 | K | |
| CRI | Ra | IF=150mA | 95 | ** | *** | ** |
| Temperature Coefficient of Forward Voltage | ∆VF/∆T | IF=150mA | −− | -2 | −− | mV/°C |
| Reverse Current | IR | VR=5V | −− | −− | 10 | μ A |
| Viewing Angle [1] | 2Θ1/2 | IF=150mA | −− | 120 | −− | Deg |
Packaging Dimension
Packing Method
Normal packing Quantity: 4000pcs/reel in vacuum bag.
Reel Specifications
Moisture Resistant Packaging
Shipping Method
Delivery time:
Order Qty<500.000pcs, 3-7 workdays.
Order Qty>500.000pcs, 7-12 workdays.
Order Qty>2000.000pcs,12-20 workdays.
Shipping by DHL/FEDEX/UPS/EMS or Air transportation. Also we can handle the goods to your freight forwarder if you have. GMKJ make sure you spend lowest delivery cost for your order.
Production flow
Company Environment
Factory Environment
Preventing LED failures caused by corrosive materials
Combined with other components into one product, LEDs are used in a wide variety of application areas. LEDs are exposed to various environments under conditions that deviate from the qualification conditions. In order to evaluate possible impacts, LEDs are examined under standard operating conditions. However, as not all possible application conditions can be simulated, this application note only illustrates certain extreme conditions, which could influence the lifetime of LED components. It provides explanations as how these effects can occur and how they might be avoided. This application note focuses on environmental conditions that affect the metal structures and might lead to corrosion. Therefore, the OSRAM Opto Semiconductors robustness classes will be introduced. In general, all application systems should be tested as to whether the materials and components used harmonize with each other
LED Design:
Depending on the environmental conditions all parts of an LED can be affected by corrosion or deterioration. In order to understand the influencing factors it is beneficial to be familiar with the exemplary structure of an SMT (surface mounted technology) LED as shown in Figure 1. An SMT LED consists of a metal lead frame, and a die latter glued or soldered to the lead frame to create one of the two contacts of the LED. For the second contact pin of the LED the die is connected electrically by a bond wire. Finally, the LED is cast with an encapsulation to cover the die and wire. For encapsulation mainly silicone or epoxy are used.
LEDs can be realized in different ways by using various materials. The selection of the material always depends on the final characteristics the LED should show. All materials have their advantages for use in various applications, however the material influences the robustness of the LEDs towards corrosive gases.
Encapsulation materials
For LED encapsulation mainly two different materials are used: • Epoxy • Silicone Epoxy encapsulations provide good mechanical stability and high resistance to gases. In addition, the adhesion to the surface is good. However, the radiation of high power LEDs, especially blue and white LEDs, may lead to fast aging and may discolor the epoxy. Furthermore, the temperature stability is not as high as for silicone, especially for high power LEDs. In contrast, for silicone encapsulations the maximum operating temperature can be increased to more than +125 °C. Silicone possesses a high optical transparency and a higher aging stability to radiation, in particular to blue and white light. It also provides good chemical resistance, but it is more permeable for gases and small molecules. Thus, harmful substances can diffuse through the encapsulation and affect the subsurface. Ultimately which encapsulation can be used always depends on the LEDs characteristics.
Electrical connection
The electrical connection between the die and the leads can be realized through a silver containing glue or by soldering. Both methods are used at OSRAM Opto Semiconductors. The silver glue provides a mechanical connection with good electrical and thermal conductivity. Moreover, silver has a good light reflection. Soldered chips provide good stability relating to corrosion. However, not all products can be equipped with a soldered chip interface.
Plating of the lead frame
The lead frame can be plated with different metals. Inside the LED silver or gold is often used. Silver plating provides the lead frame with high light reflectivity and good connectivity. In general, the plating has good stability against a lot of environmental impacts. However, there are various harmful substances which can affect the LED, e.g. sulfurous compounds. In contrast, gold plating offers higher chemical stability, especially against sulfur. However, the light reflection is not as high as with silver plating, a characteristic which has to be considered in some LED products. The lead frame outside of the LED housing can be plated with different materials. Among others, pure tin, gold or gold alloys and also pure silver are used.
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