Guangmai Technology is professional in making the CSP LED Chip COB Array 50W Flip Chip Board.
CSP (Chip Scale Package) package means chip scale package. The latest generation of memory chip packaging technology for CSP packaging has improved its technical performance. The CSP package allows the chip area to package area ratio to exceed 1:1.14, which is quite close to the ideal 1:1 situation. The absolute size is only 32 square millimeters, which is about 1/3 of the ordinary BGA, which is only equivalent to TSOP memory. 1/6 of the chip area. Compared with the BGA package, the CSP package can increase the storage capacity by three times under the same space.
CSP is the most advanced integrated circuit packaging form. It has the following characteristics:
①Small size
Among various packages, CSP has the smallest area and smallest thickness, so it is the smallest package. In the case of the same number of input/output terminals, its area is less than one-tenth of the 0.5mm pitch QFP, which is one-third to one-tenth of the BGA (or PGA). Therefore, it occupies a small area of the printed board during assembly, which can increase the assembly density of the printed board, and the thickness is thin, which can be used for the assembly of thin electronic products;
②The number of input/output terminals can be many
In various packages of the same size, the number of input/output terminals of the CSP can be made more. For example, for a 40mm×40mm package, the number of input/output terminals for QFP is 304 at most, 600-700 for BGA, and 1,000 for CSP. Although the current CSP is mainly used for the packaging of circuits with a small number of input/output terminals.
③Good electrical performance
The length of the interconnection line between the chip inside the CSP and the package shell wiring is much shorter than that of QFP or BGA, so the parasitic parameters are small, and the signal transmission delay time is short, which is beneficial to improve the high-frequency performance of the circuit.
④Good thermal performance
The CSP is very thin, and the heat generated by the chip can be transmitted to the outside world in a short channel. The chip can be effectively dissipated by air convection or by installing a heat sink.
⑤CSP is not only small in size, but also light in weight
Its weight is less than one-fifth of QFP with the same number of leads, which is much less than that of BGA. This should be extremely beneficial for aviation, aerospace, and products with strict weight requirements.
⑥CSP circuit
Like other packaged circuits, it can be tested and aging screened, so early failure circuits can be eliminated, and the reliability of the circuit can be improved. In addition, the CSP can also be hermetically packaged, so the hermetic packaged circuit can be maintained The advantages.
⑦CSP products
Its package body input/output terminal (solder ball, bump or metal strip) is on the bottom or surface of the package body, suitable for surface mounting.
CSP LED Chip COB Array 50W Flip Chip Board specifications:
CSP LED Chip COB Array 50W Flip Chip Board application
About Guangmai
Datasheet:
For more details, please feel free to contact with Guangmai Tech directly.
You can download the datasheet of CSP LED Chip COB Array 50W Flip Chip Board from the head of this page.
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