Driven by the commercialization of MiniLED technology this year, Shuote Technology has achieved a new high in the contribution of the sorting machine, and the EPS is expected to set a new high throughout the year. Shuttle said that the demand for MiniLED next year is very positive, and that major American manufacturers are expected to continue to adopt related technologies, which is a big plus.
Shuttle focuses on Pick & Place pick-and-place technology, which can be applied to Sorter and Bonder. Application areas include semiconductors, LED/LD, and optical glass components.
Shuote signed an authorized cooperation with Huite in 2014 to jointly promote LED sorting machines. At present, the cumulative output of LED sorting machines has exceeded 12,000, including Fucai's Jingdian, Sanan Optoelectronics, and Tongxindian are all customers. .
Shuttle said that this year, thanks to the introduction of MiniLED backlight technology by major American manufacturers, the demand for Mini LED process equipment has increased greatly due to its commercialization. Manufacturers supplying MiniLED chips from major American manufacturers, whether in Taiwan, Malaysia or the future Manufacturers in mainland China all use the company's sorting machine, and almost won the entire market.
Looking forward to next year, Shuttle said that it continues to be optimistic about the MiniLED market demand. From the perspective of customer feedback, it is very positive, but there are still uncertainties brought about by the epidemic to be seen.
As for the previous noise, the next-generation panel of a major American manufacturer may switch to OLED technology. Shuttle said that this is not true. The major manufacturer will continue to introduce it, which is a big plus for the MiniLED application side.
In addition to LED equipment, Shuttle also cultivates semiconductor equipment. This year, it launched a pre-arranged mass transfer die-bonding equipment, which is used in fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP), and continues to invest Nano-level high-precision hybrid bond equipment, and cooperated with Taiwan Industrial Research Institute for equipment verification, in the future can be used in Chiplet (small chip) and Solderless (non-tin) heterogeneous bonding advanced packaging process.
Shuttle said that in the future, it will continue to develop advanced semiconductor process equipment and expand the scale of operations through industrial strategic cooperation. It has already conducted project verification with a semiconductor factory.
