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LED packaging process Due to the different structure of the LED, there are some differences in the packaging process, but the key processes are the same.
What are the characteristics of light-emitting diodes?
So what are the factors affecting the cure rate of UV LEDs?
Heat dissipation Due to the limitation of semiconductor light-emitting diode chip technology, the photoelectric conversion efficiency of light-emitting diodes still needs to be ...
Common soldering methods can be divided into electric soldering iron soldering, heating platform soldering and reflow soldering soldering, etc
LED soldering conditions reflow soldering: please preheat at 150℃, within 2 minutes, and perform one soldering at 240℃ within 5s after heating.
Each manufacturer may also have certain errors due to different test instruments, and the imported chips used by some manufacturers are brighter than some manufacturers'
The concept of integrated light source was proposed by Dr. Miller of Bell Labs in 1969
1. Features of integrated light source: 1. High luminous efficiency. After decades of technological improvement
