Specification
IEC62778, EN62471, RoHS, LM-80 certificate
low light decay <3% over 6000hrs.
minimum wavelength gap 2.5nm.
Osram chip/epileds chip /epistar chips available.
Oxide aluminum/nitride aliuminum base available.
over 12 years led manufacturer experience.
fast delivery time around 5 worldays.
Product Name | 1W SMD 3535 Blue LED | Product Model | GS-3535B2 |
Power Dissipation | 1W | Light Color | Blue |
Forward Voltage | 3.0-3.4V | Viewing Angle | 120° |
Forward Current | 350mA | Operating Temperature | -40~+60 ℃ |
Wavelength | 450-460nm,460-470nm | Storage Temperature | -40~+85 ℃ |
Luminous Flux | 350mA | Soldering Temperature | 260℃ |
@ Current | 20-30LM | Other 3535 Type | 1W, 3W |
Advtange and Application
• Well-known chip material
• 99.99% gold wire bonding
• High flux per LED
• More energy efficient than incandescent and most halogen lamps
• Instant light(less than 100ns)
Processing of SMD LED
This application note provides a basic overview of the essential aspects and influencing factors regarding the processing of SMD LEDs.
A. Introduction
In general, LEDs do not differ in terms of processing from other electronic SMD components. However, because of their optical properties their specific package materials might be more sensitive, and thus the LEDs can be rapidly impaired or may fail totally with regard to their electro-optical features if they are not correctly handled or assembled. With progressive miniaturization and new package concepts, requirements for LED processing are becoming more demanding, for example in respect to the assembly and soldering processes. With new miniature high power LEDs it is for example essential that the soldering process is designed and adapted in the way that defects (voids) in the solder joints are minimized. The lower the number of voids, especially at the thermal pad of the LED, the better the thermal connection to the PCB and thus the lower the thermal load. This in turn influences the performance and lifetime of the LED. The possible extent of influence is diverse in such cases and is usually not determined by only a single processing step. Factors such as component finish, material and composition of the solder, design of the solder stencil, reflow solder profile or process atmosphere are interlinked and contribute to the solder result.
The professional processing of SMD LEDs from OSRAM Opto Semiconductors is outlined below. Essential aspects and important factors of influence within the manufacturing process are described.
B. SMD LEDs
SMD (Surface mounted device) LEDs are usually defined as devices with packages that can be soldered directly onto the surface of a printed circuit board via solder-capable contacts. Plastic molding compounds, ceramic or epoxy substrates are used for the package, cast with epoxy or silicone. According to the package type and variant, the contacts of traditional LED devices are usually formed as Gull-Wing or J-Leads. With newer types of package, especially for higher packing densities, the solder joints are small metal-coated connection surfaces on the backside of the package (bottom onlyterminated (BoT)). Figure 1 shows a selection from the SMD LED portfolio of OSRAM Opto Semiconductors.
As with all products from OSRAM Opto Semiconductors, also its SMD LEDs fulfill the current RoHS guidelines (European Union & China), and therefore contains no lead or other defined hazardous substances.
Due to their geometric dimensions, beginning with a size of approx. 1 mm to 10 mm, SMD LEDs belong to the small constructions and are packaged in tapes of plastic because they are usually required in larger quantities. The tapes with a width of 8 mm to 24 mm are coiled on a reel, whereby the reel size and the quantity on the roll are dependent on the form of the LED. The dimensions of the LED-specific tape from OSRAM Opto Semiconductors are in accordance with IEC 60286-3, EIA 481-C and can be found on the website in the Product Catalog section, in chapter 6 “Tape and reel” of the Short-Form Catalog, or on the respective LED data sheets. For storage and dispatch, the reels are packed in vacuum sealed dry bags (compliant to MIL-STD 81705C, type 1, class 1) together with desiccants and a moisture indicator card (Figure 2). The reels and dry bags are designated with a standard barcode product label (BPL). This label contains information on the manufacturer (OSRAM Opto Semiconductors), an indication of origin, product designation, batch number, date code, material number and quantity contained.
The BPL also references the ESD-, and moisture sensitivity class, development designation, brightness class and grouping of the LEDs as supplementary information if required. It is generally recommended to check the bag after receipt for damage and completeness. No holes, dents or fissures of any type should exist that could impair the content. For the storage of its SMD LEDs in unopened dry packaging, OSRAM Opto Semiconductors specifies a maximum storage time of 24 months (shelf life) with ambient conditions not exceeding 40 °C and a humidity content of max. 90 % RH (relative humidity). Further information can be found in the ZVEI guide for the long-term storage of components, assemblies and devices (“Leitfaden – Langzeitlagerfähigkeit von Bauelementen, Baugruppen und Geräten”). It is necessary to check the moisture indicator card contained inside directly after opening and before processing of the components. The indicator changes color from blue to pink when the corresponding moisture grade is exceeded. If the color changes, the specified handling information (see HIC and moisture sensitive label – ML) must be observed and the components should be dry backed if necessary (also see JEDEC J-STD-033). After opening the dry bag, LEDs have a specific floor life depending on their moisture level classification (according to JEDEC-STD-020). The floor life specifies the time period after removal from a dry bag, dry storage or dry bake and before reflow soldering
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