Products Description
12mm 80W 400nm Flip chip UV SMD LED Module Specs:
| Product name | 12mm 80W 400nm Flip chip UV SMD LED Module |
| Part number | GD-1212P400-12C3D-J1D5B |
| Chips brand | Taiwan Epistar 45mil flip chip |
| Input |
36-40vdc max 2100mA |
| Radiation power |
30000-40000mW at 2100mA |
| Lighting Efficiency | Invisible UV lighting ,does not mention about the LPW |
| Color |
400-410nm UV wavelength |
| Power |
Max 80 Watt at 2100mA |
| Package material | ALN Ceramic size 12x12mm |
| Lighting angle |
120 degree |
| Brand and manufacturer | GMLEDs, GMKJ |
| Warranty | 4 years |
| OEM service |
1. SKD parts available; 2. Customised LED array with the size you need is OK here. |
What are the advantages of flip-chip UV LED packaging compared to traditional wire-bonded UV LED packaging?
Flip-chip UV LED packaging offers several advantages over traditional wire-bonded UV LED packaging:
Better Thermal Management: Flip-chip packaging allows direct contact between the chip and the heat sink, improving heat dissipation.
Higher Light Efficiency: Flip-chip packaging reduces light loss in the packaging materials, enhancing light output efficiency.

Lower Thermal Resistance: Direct contact between the chip and the substrate reduces thermal resistance, contributing to longer device lifespan.
Higher Reliability: Flip-chip packaging minimizes the use of gold wires, reducing the risk of failure due to wire breakage.
More Compact Design: Flip-chip packaging enables smaller package sizes, making it suitable for high-density integration applications.
12mm 80W 400nm Flip chip UV SMD LED Module Picture:


12mm 80W 400nm Flip chip UV SMD LED Module dimensions:

12mm 80W 400nm Flip chip UV SMD LED Module specs:
|
Parameter |
Symbol |
Conditions |
Min |
Avg. |
Max |
Units |
|
Forward Voltage |
VF |
IF=2100mA |
36.00 |
-- |
39.00 |
V |
|
Thermal Resistance Junction To Board |
RΘJ-B |
IF=2100mA |
-- |
2 |
-- |
°C/W |
|
Radiant Flux |
Φe |
IF=2100mA |
30000 |
−− |
40000 |
mW |
|
Peak wavelength |
λp |
IF=2100mA |
400 |
−− |
410 |
nm |
|
Reverse Current |
IR |
VR=60V |
−− |
−− |
10 |
μ A |
|
Viewing Angle |
2Θ1/2 |
IF=2100mA |
−− |
120 |
−− |
Deg |
Application
12mm 80W 400nm Flip chip UV SMD LED Module applications
12mm 80W 400nm Flip chip UV SMD LED Module, especially one made with a ceramic base for efficient heat dissipation and durability, is typically used in applications where high-intensity UV light is needed for effective curing and processing. The main applications include:
UV Curing in Industrial Printing:
Used in inkjet and offset printing for curing inks, coatings, and varnishes on various substrates (e.g., paper, plastic, and metal).
Offers fast curing speeds, enabling high throughput in commercial printing processes.
Adhesive and Coating Curing:
Ideal for curing UV-sensitive adhesives used in electronics, automotive, medical devices, and other precision manufacturing industries.
Also used in coating applications where a quick, durable finish is required, such as wood finishes, protective coatings, and optical coatings.
3D Printing:
Utilized in SLA (Stereolithography) and DLP (Digital Light Processing) 3D printing for curing photopolymer resins layer by layer.
Allows for the production of high-precision 3D printed parts with smooth surfaces.
PCB and Electronics Manufacturing:
Employed in curing conformal coatings and UV adhesives on printed circuit boards (PCBs) and electronic components for added protection and durability.
Ensures quick curing with minimal heat damage to sensitive electronic components.
Automotive and Aerospace Component Manufacturing:
Used to cure UV-sensitive paints, coatings, and adhesives in manufacturing, providing strong, durable bonds and surface protection.
Beneficial in high-volume automotive production lines due to its fast-curing properties.
Optical and Lens Bonding:
Suitable for bonding lenses and other optical components in applications where precision and clarity are critical, such as in eyewear, cameras, and medical imaging equipment.
The ceramic base of the 200W UV LED module helps in efficient heat dissipation, ensuring longer operational life and consistent performance under high-power conditions, making it ideal for demanding, continuous-use environments.



About GMLEDs
Certification available in GMLEDs
Guangmai Technology Certificaitions

CE

CE-LVD

FCC

ROHS

ISO9001

LM-80
About GMLEDs/GMKJ
Shenzhen Guangmai Electronics Co., Ltd., established in 2009 with a registered capital of 30 million RMB, is an enterprise specializing in the manufacturing of semiconductor packaging devices. Its subsidiaries include Shenzhen Guangmai Technology Co., Ltd., Guangmai Technology (Hong Kong) Co., Ltd., and Shenzhen OKAY Lighting Co., Ltd., forming a powerful corporate group. Guangmai Electronics is a national high-tech enterprise and a specialized and new enterprise in Shenzhen. It has been ranked among the top 100 in China's LED industry and has been awarded honors such as Shenzhen Standard Application Demonstration Unit and Guangdong Integrity Demonstration Enterprise.
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