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SMD LED Chip 1 Watt Super High RA90 RA95
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SMD LED Chip 1 Watt Super High RA90 RA95

Item Name:SMD LED Chip 1 Watt Super high RA90 RA95
Model Number: GS-3030-130150
Input Current: 150mA
Power:1 Watt
LED package type:3.0*3.0mm flat package
Warranty: 4 years
Brightness:130-150LM
Color:CRI>90-95 6000-6500K
Chip brand: Bridgelux
Life span: 50000hrs
Delivery time: 7 workdays
Place of Origin: Shenhzen,China

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  • Description

    Guangmai Technology is professional in making the SMD LED Chip 1 Watt Super high RA90 RA95


    Whether the lighting is good or not, the key depends on the color rendering index, which is very important for children

    R9 (saturated red) is an indicator to make up for the lack of red spectrum in LEDs. In the industry, home lighting should not be lower than 0, while GMKJ LED is higher than 60.


    The higher the Ra and R9, the richer the expressiveness of the color, the higher the color precision and the contrast, and the higher the visual fatigue, the slow response, and even myopia.

    The maximum color rendering index is 100, which is the same as that of sunlight. The lower the color rendering index, the lower the color reproduction and the worse the quality of the light source.


    Why choose high CRI?

    1. High color reproduction: high color saturation.

    2. Prevent myopia.

    3. It can meet the needs of users.


    Solve the user's pain point: things are not real under the light, and protect children's eyesight.



    3030 ra90 smd led


    Package Size:

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    How a LED is Made: light emitting diode structure

    There are very many different types of LED, but to explain how they are made and what their structure is, the best starting point is the structure and fabrication of a simple indicator light emitting diode.

    Light emitting diodes are a specialised form of PN junction diode that have been designed to optimise their electroluminescence. To achieve the optimum results, the structure and fabrication processes need to be tailored to ensure that the light output is optimised.

    There are a number of different aspects to the LED structure and LED fabrication. These include not only the LED fabrication itself, but also the packaging of the LED once the semiconductor chip itself has been fabricated.


    LED die structure

    The die or the actual semiconductor element of the light emitting diode is the active part of the overall diode. There are two basic configurations which can be used.

    • Edge emitting LED structure:   This form of LED structure emits light in a plane parallel to the junction of the PN junction. In this configuration the light can be confined to a narrow angle.

    • Surface emitting LED structure:   This form of LED structure emits light perpendicular to the plane of the PN junction.

    The active films of the LED structure are normally grown epitaxially - often by liquid phase or vapour phase epitaxy. The substrates are chosen to have a close lattice match to the active layers.

    Common substrates are GaAS, GaP, InP. The PN junction can be created by either impurity diffusion, ion implantation, or it can be incorporated during the epitaxial growth phase.

    Commercially, LEDs exist in a variety of forms, ranging from individual LED indicators where there is just one LED per package, through a variety of displays, right up to vast arrays of LEDs in LED screens.

    For some limited applications, it is possible to use a variety of LED PN diode junction types. These can include Schottky contacts and MIS (metal-intrinsic-semiconductor) junctions. However these are normally less efficient and sometimes more difficult to form reliably.


    Overall LED package structure

    There are many different styles of LED that are available. One of the most widely used is the simple LED indicator package. This provides insight intot he way in which LEDs can be packaged.

    In addition to the very simple LED indicator, there are many other types of LED including alphanumeric displays, and more complicated LED displays.

    The structure of the panel indicator LED package can be split into three main elements:

    • Semiconductor die:  This is the light emitting diode semiconductor element itself.

    • Lead frame:  This portion of the LED package houses the die and provides the connection.

    • Encapsulation:  This surrounds the assembly and acts as protection. It is also designed to disperse the light in the required manner.

    The die is bonded into a recess in one half of the lead frame, called the anvil due to its shape. This is done using conductive epoxy. The recess in the anvil is shaped to throw the light radiation forward. The top contact from the die is then wire-bonded to the other lead frame terminal which is often called the post.


    About Guangmai Company:

    workshop-web

    Shenzhen Guangmai Technology Co., Ltd has a workshop area of 6000 square meters, more than 300 R&D teams and production line personnel, 30 fully automated production lines, high-speed die-bonding machines, automatic wire bonding machines and glue dispensers, high-speed spectroscopy and color separation machines, Advanced equipment such as high-temperature and high-humidity test chamber, cold-light impact tester, etc., to ensure product stability and consistent output. Mainly 2835, 5730, 3014, 3528, 5050 white light, single color. Relying on a complete and complete corporate system, the company has passed a number of authoritative certifications such as 1S09001 quality assurance system and ROHS. In the future, we will continue to forge ahead with advanced concepts, hardworking spirit, professional team, and humanized management, and strive to stabilize the industry's first-class brand, and work with friends from all walks of life to create a brilliant future and realize a beautiful vision.




    Datasheet:

    For more details, please feel free to contact with Guangmai Tech directly.

    You can download the datasheet of CRI Ra over 95 High Color Rendering Index SMD LED Chip 1 Watt from the head of this page.


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